These sensors, which are ideal for space-constrained environments, feature compact, lightweight packaging and offer superior accuracy, reduced system complexity, and significant environmental benefits.
Molex has introduced the Percept Current Sensors, designed to meet the rising demand for precise busbar current sensing in the industrial and automotive sectors. These sensors integrate Infineon’s high-precision coreless current sensing technology with Molex’s proprietary electronics packaging, which reduces the sensors’ size and weight and simplifies installation and system integration.
The combination of Infineon’s sensor technology and Molex’s packaging methods enables the development of current sensors that optimise space and performance while minimising design and manufacturing complexities and costs. The Sensors, characterised by a compact and coreless design, are 86% lighter and up to half the size of competing sensors. This allows for higher-density device packaging, reducing overall system weight and providing greater design flexibility. These sensors are handy in applications with limited space and those susceptible to electromagnetic interference (EMI). They maintain accuracy within 2% across a broad temperature range and product lifespan, with low sensitivity and offset errors. The differential Hall-effect sensor design from Infineon effectively suppresses noise from stray magnetic fields, which is beneficial in industrial motor-drive and automotive applications.
The key features include:
- Available in both industrial- and automotive-grade options.
- Current ranges: +/-450.0A to +/-1,600.0A.
- Operating temperature range: -40°C to 125°C.
- Supply Range: 4.5 V to 5.5V
The company’s proprietary packaging technology integrates various mechanical components, enhancing system integration and sensor accuracy through precise chip placement and factory calibration. This technology also reduces the environmental impact of manufacturing by using 99% less water and eliminating the need for chemicals or the generation of copper sludge. Configurable design options, including a sensor-in-busbar design, allow for plug-and-play deployments, reducing development time and costs.
Matthias Grewe, vice president at Infineon Technologies, noted that the XENSIV™ TLE4973 and TLE4972 sensors offer flexibility across different power ranges. When combined with Molex’s packaging, these sensors create a compact, efficient solution for industrial and automotive markets.
For more information, click here.
